To show how the mechanical modulus and loss factor change at the glass transition when measured at different frequencies.
Handbook | | Page | | Keywords |
Thermosets 1 | 116 | thermoset, curing, DMA, shear mode, frequency influence, glass transition, activation diagram, cooperative rearrangements, loss factor, loss modulus, molecular mobility, relaxation, Vogel-Fulcher equation, WLF equation, KU600 epoxy resin, |
The frequency dependence of the glass transition | Thermal Analysis Application No. HB25 | Application published in METTLER TOLEDO TA Application Handbook Thermosets Volume 1